Used in semiconductor equipment, etching systems, and high-temperature process equipment.
Used for connecting quartz furnace tubes, vacuum systems, and process equipment.
Suitable for precision grinding, polishing, and precision drilling applications.
Cut into various customized thickness specifications based on ingot dimensions.
Precision-polished for use in optical applications, vacuum systems, and equipment viewing ports.
High-temperature resistant, low-contamination components for the interior of semiconductor equipment.
Used in wafer manufacturing and high-temperature process equipment fixtures.
Such as quartz slots, positioning rings, thermal insulation rings, connectors, and custom CNC-machined parts.