Engineered for high-temperature diffusion chambers, vacuum-tight ultraviolet lamps, and laser optics.
Understanding the critical differentiation between natural fused quartz and high-transmission synthetic UV fused silica (SiO₂) for photonic and semiconductor architectures.
Fabricated through chemical vapor deposition (CVD) or plasma oxidation of high-purity silicon tetrachloride (SiCl₄). This gas-phase combustion yields an ultra-amorphous vitreous silica containing less than 0.1 ppm total metallic impurities, totally bypassing crystalline inclusions typical of natural pegmatite quartz.
Standard UV grade fused silica features controlled hydroxyl content (800 to 1200 ppm OH⁻). The elevated OH bond density prevents laser-induced color center formation (E' centers), guaranteeing remarkable solarization resistance under prolonged high-flux 193nm ArF and 248nm KrF excimer laser exposure.
With an isotropic 3D molecular lattice, UV fused silica exhibits near-zero thermal expansion (5.5 × 10⁻⁷ /K) and refractive index homogeneity down to Δn ≤ 1 × 10⁻⁶ (Class 0 / Grade A). Optical windows maintain distortion-free wavefront transmission across the 185 nm to 2500 nm spectrum.
| Material Property Parameter | UV Synthetic Fused Silica (Type III / IV) | Optical Fused Quartz (Type I / II) | Borosilicate Crown Glass (N-BK7) |
|---|---|---|---|
| Deep UV Transmittance (193 nm, 10mm) | > 90.5% (Internal: > 99.0%) | < 20% (Severe Absorption Edge) | 0% (Opaque below 310 nm) |
| Hydroxyl (OH⁻) Content | 800 – 1,200 ppm (High UV Grade) | < 30 ppm (IR Optimized) | N/A (Multi-component Oxide) |
| Total Metallic Impurities | < 0.1 ppm (Electronic Cleanliness) | 10 – 30 ppm (Fe, Al, Ti traces) | Compound Glass (Oxides of B, Na, K) |
| Coefficient of Thermal Expansion (CTE) | 0.55 × 10⁻⁶ / K (20°C to 300°C) | 0.55 × 10⁻⁶ / K | 7.1 × 10⁻⁶ / K |
| Maximum Working Temp (Continuous) | 1,100 °C (Strain Point: 1,070 °C) | 1,150 °C (Softening: 1,683 °C) | 450 °C (Transformation: 525 °C) |
| Laser Induced Damage Threshold (LIDT) | > 20 J/cm² (1064 nm, 20ns, 20Hz) | > 8 J/cm² | < 5 J/cm² |
From deep-submicron lithography steppers to high-vacuum reactive plasma chambers, custom silica structures perform where thermal or optical failure is intolerable.
Photomask substrates and wafer-exposure condenser lenses demand zero bubble inclusions (DIN 3140 Class 0). UV synthetic silica provides extreme optical transmission at 193nm (ArF immersion) and 248nm (KrF), alongside thermal stability that guarantees sub-nanometer overlay accuracy under continuous laser pulse irradiation.
Frequency tripling and quadrupling (355nm and 266nm) Nd:YAG laser systems generate immense thermal loading. Our laser-grade fused silica windows, Brewster angle prisms, and beam splitters prevent thermal lensing and exhibit certified high laser-induced damage thresholds (LIDT) preventing catastrophic bulk rupture.
Analytical instruments rely on fused silica flow cells, cuvettes, and capillary tubes. Offering full transparency down to 190nm, our custom quartz flow cells empower HPLC detectors, DNA sequencing instruments, and pharmaceutical absorption spectrophotometers without baseline drift or background luminescence.
Industrial germicidal purification systems utilize high-purity fused silica sleeves to house high-output amalgam UV-C lamps (253.7nm) and vacuum-UV lamps (185nm for TOC reduction and ozone generation). Extreme hydrostatic pressure resistance and chemical bio-fouling inertness safeguard municipal and semiconductor cleanrooms.
High-altitude reconnaissance, spacecraft observation viewports, and re-entry thermal diagnostic enclosures utilize custom fused silica windows. Its near-zero expansion coefficient withstands thermal shocks from -150°C to +1000°C instantly without micro-cracking or atmospheric seal breach.
LPCVD, PECVD, oxidation, and rapid thermal annealing (RTA) furnaces operate in excess of 1,050°C in corrosive halogen (HCl, Cl₂) and silane chemistries. Heavy-wall fused silica process tubes, slotted quartz boats, and injectors prevent heavy metal wafer contamination (Fe, Cu < 0.01 ppm).
Harnessing regional industrial concentration to deliver raw-material traceability, custom design agility, and dependable high-volume output.
Located in Donghai County, Jiangsu—the epicentre of China's quartz and silicon materials industry—Southeast Quartz coordinates raw feedstock synthesis, plasma fusion, rough blank coring, and precision hot flame-working within a 15-kilometer operational radius. This geographical synergy eliminates logistics delays and secures guaranteed batch reproducibility.
Unlike standard glass shops that outsource heavy tube shaping or multi-axis slotting, our standardized factory houses 5-axis ultrasonic CNC machining centers, planetary double-sided grinding units, and precision glass lathes under one management system. We execute customized designs from technical drawings within days rather than months.
By coupling continuous plasma-fused ingot inventories with automated cold sawing and robotic flame polishing, we reduce typical prototype lead times from the industry-average 12 weeks down to 10–14 days. Sourcing managers achieve 35% to 50% expenditure optimization compared to legacy Western suppliers without sacrificing optical precision.
Anticipating the technological requirements of next-generation 2nm semiconductor nodes, excimer lasers, and quantum photonic infrastructure.
Developing synthetic silica with modified stoichiometry via fluorine-doping (Si-F bonds). Fluorine incorporation suppresses vacuum-UV defect absorption bands at 163nm and 215nm, minimizing compaction and transmission degradation under high-repetition excimer laser operation.
Transitioning from mechanical pitch polishing to deterministic MRF and Ion Beam Figuring (IBF). This enables automated deterministic sub-surface damage removal, attaining surface roughness Ra < 0.15 nm and surface figure accuracy λ/30 for ultra-precision laser mirrors and DUV inspection windows.
Deploying stereolithography 3D printing of sub-micron silica-loaded photopolymer slurries followed by thermal debinding and high-temperature vacuum sintering. This yields 100% dense transparent optical silica components with internal cooling microchannels impossible to cut via traditional CNC lathes.
Rigorous test methodologies ensuring that custom fused silica optics and high-temperature quartz tubes perform within client-specified tolerances upon receipt.
Every welded quartz reactor, vacuum-insulated sleeve, and flanged diffusion tube undergoes vacuum chamber helium mass spectrometry testing. We verify leak tightness exceeding 1 × 10⁻¹⁰ Pa·m³/s, eliminating process chamber atmosphere contamination and safeguarding high-vacuum integrity.
Our metrology laboratory uses Zygo GPI phase-shifting laser interferometers to evaluate transmitted wavefront distortion (TWD), surface irregularity, and radius of curvature on all optical windows, mirrors, and flats. Full metrology interferograms and inspection certificates accompany every production batch.
Using dual-beam spectrophotometers (185nm to 3200nm), we verify external and internal transmittance data for each melt batch. UV absorbance criteria, OH⁻ absorption peaks at 2.73 μm, and absence of the 248nm oxygen-deficiency band are confirmed prior to custom part machining.
Parts undergo multistage ultrasonic pickling in high-purity semiconductor-grade hydrofluoric/nitric acid baths to remove all micro-surface contaminants, followed by 18.2 MΩ·cm DI water rinsing. Packaged inside ISO Class 5 (Class 100) cleanrooms in double-sealed anti-static bags under inert nitrogen.
In-depth responses covering material selection, manufacturing tolerances, thermal properties, and operational parameters.
Built to customer drawings for semiconductor diffusion, chemical vapor deposition, and analytical laboratory systems.
Our senior optical and glass engineers review 2D/3D CAD models within 24 hours to verify manufacturability, optical tolerances, and thermal limits.
Specify UV Synthetic Fused Silica (Type III/IV, high-OH) for 185nm–260nm transmission and laser resistance, or Low-OH Infrared Synthetic Silica (<1 ppm OH⁻) for broadband optical systems up to 3500nm without water absorption dips.
Include OD/ID, length, wall thickness, bevel requirements, surface roughness (Ra), transmitted wavefront distortion (TWD, e.g., λ/10 @ 633nm), and scratch-dig specifications per MIL-PRF-13830B or ISO 10110.
Detail continuous and peak service temperatures, ramping thermal cycles, chemical exposure (e.g., HF, HCl, reactive fluorine plasmas), pressure differentials, and target batch or annual delivery volumes for rapid quotes.
