Direct factory production of large-bore fused quartz tubing, high-temperature insulated quartz rings, optical plates, and heavy-duty industrial heating assemblies.
Critical thermomechanical properties, hydroxyl content management, and trace elemental analysis defining Southeast Quartz industrial laboratory standards.
Operating reliably up to a softening point of 1,683°C and an annealing point of 1,215°C, high-purity fused silica exhibits a near-zero coefficient of thermal expansion (5.5 × 10⁻⁷/K). This allows laboratory components to be red-heated to 1,150°C and immediately quenched into ice water without micro-fracturing or catastrophic failure.
With silicon dioxide (SiO₂) concentrations exceeding 99.995%, our quartz laboratory components are virtually inert to all acids (including boiling aqua regia, nitric acid, and sulfuric acid) with the sole exceptions of hydrofluoric acid and concentrated phosphoric acid above 300°C. Total metallic impurities (Al, Fe, Ti, Ca, Mg, Na, K, Li) remain verified beneath strict parts-per-billion thresholds.
Synthesized and electrically fused options deliver uniform optical transmission extending from the deep ultraviolet (DUV 190 nm) through the visible spectrum into the mid-infrared (MIR 3,500 nm). Ideal for spectrophotometer flow cells, photochemical reaction vessels, UV digestion tubes, and excimer laser plasma windows.
| Physical / Chemical Property | Test Standard / Method | Transparent Fused Quartz (JGS-2 Grade) | Synthetic Fused Silica (JGS-1 Grade) |
|---|---|---|---|
| SiO₂ Purity Concentration | ICP-OES / GD-MS | ≥ 99.99% (≤ 20 ppm total metal) | ≥ 99.999% (≤ 1 ppm total metal) |
| Softening Point (°C) | ASTM C338 / Dilatometry | 1,683 °C | 1,600 °C |
| Annealing Point (°C) | ASTM C336 | 1,215 °C | 1,120 °C |
| Coefficient of Thermal Expansion (CTE) | 20°C – 320°C (TMA) | 5.5 × 10⁻⁷ / °C | 5.1 × 10⁻⁷ / °C |
| Hydroxyl Group Content (OH⁻) | FTIR Spectrometry | ≤ 30 ppm (Electrically Fused) | ≥ 800 – 1200 ppm (Flame Hydrolysis) |
| Dielectric Strength (20°C) | IEC 60243-1 | 25 – 40 kV/mm | 30 – 50 kV/mm |
| Helium Leak Tightness Rate | ASTM E499 / He Mass Spec | ≤ 1.0 × 10⁻⁹ mbar·L/s | ≤ 1.0 × 10⁻¹⁰ mbar·L/s |
How high-performance quartz glassware acts as the mission-critical foundation across advanced cleanroom manufacturing and ultra-trace analytical chemistry.
Vertical and horizontal diffusion furnaces, atomic layer deposition (ALD), and chemical vapor deposition (CVD) demand inert, vacuum-tight process tubes, wafer carrier boats, and plasma injectors. Our quartzware withstands harsh fluorine-free plasma chemistries, silane (SiH₄), and ammonia (NH₃) without particulate spallation or elemental cross-contamination.
Transitioning towards large-format silicon ingots requires oversized fused quartz furnace tubes exceeding 450 mm in outer diameter and customized quartz boats designed to prevent wafer sagging during boron and phosphorus thermal diffusion cycles at sustained temperatures above 1,050°C.
In ICP-MS, ICP-OES, and AAS sample digestion, conventional borosilicate glass leaches significant boron, sodium, iron, and barium into sample solutions. Our acid-leached high-purity quartz digestion beakers, crucibles, and volumetric flasks ensure blanks approach absolute zero detection limits.
Featuring superior transmission down to 185 nm for ozone generation and mercury excitation, our transparent quartz reaction jackets, water-cooled immersion wells, and microwave digestion vessels ensure maximum photon flux while safely containing high internal pressures.
How Southeast Quartz is engineering the next generation of labware for sub-2nm node fabs, microfluidic biochips, and quantum computing chambers.
As semiconductor lithography migrates through Extreme Ultraviolet (EUV) and High-NA systems, quartz substrate requirements shift towards zero thermal expansion synthetic glass with sub-nanometer surface roughness. Our magneto-rheological finishing (MRF) research pipeline targets Ra < 0.3 nm to completely eliminate phase distortion and scattered light in precision analytical spectrophotometry.
Next-generation biochemistry and continuous flow synthesis necessitate fused quartz microfluidic chips. Utilizing ultrafast femtosecond laser-induced chemical etching (FLICE), we create complex 3D internal microfluidic channels without thermal stress cracks, enabling monolithic flow cells capable of operating under 100+ bar pressure.
Continuous operating conditions above 1,150°C typically induce cristobalite phase transformation (devitrification) initiated by alkali trace migrations. Southeast Quartz is actively developing proprietary rare-earth and aluminum-doped surface passivation barriers that retard crystalline nucleation, doubling component service lifespan in high-temp diffusion furnaces.
Located at Donghai, Jiangsu—the undisputed global silicon materials hub—Southeast Quartz marries raw mineral dominance with cutting-edge automated glass manufacturing.
Donghai represents the nucleus of high-purity quartz refining in China, processing over 80% of regional advanced silica stock. Our direct access to plasma-melted ingots and continuous electrically fused tubes bypasses third-party merchant premiums, delivering an unshakeable 20% to 35% cost and lead-time advantage directly to international procurement teams.
Our 5-axis ultrasonic CNC machinery suite specializes in non-conductive, ultra-hard brittle ceramics. We execute wafer carrier comb slotting (pitch precision ±0.01 mm), core drilling, edge beveling, countersinking, and complex pocket milling with zero mechanical chipping, ensuring repeatable fitment in automated robotic wafer transfer loaders.
Combining automated synchronous hydrogen-oxygen glassblowing lathes with seasoned master craftsmen boast over 15 years of bench experience. We weld high-vacuum quartz flanges, spherical joints, thermocouple wells, and manifold branches with seamless thermal transition zones and controlled weld-seam fillet geometry.
Spectroscopic GD-MS metallic screening, internal bubble grading via polarized optical stress-meters, and OH⁻ level indexing.
Computer-monitored hydrogen-oxygen lathe shaping, robotic tube stretching, flanging, and gas-tight joint welding.
Diamond tool surface grinding, laser slotting for semiconductor boats, cylindrical lap finishing, and hole perforation.
Programmable 1,180°C thermal stress-relief cycles, followed by HF/HNO₃ multi-stage ultra-pure de-ionized water ultrasonic scrubbing.
Class 1,000 cleanroom inspection, CMM dimensional verification, Helium mass spectrometry leak tests, and vacuum packaging.
Eliminating procurement friction for global enterprises in North America, Europe, Japan, and the Middle East through internationally accredited material reporting.
All semiconductor-grade quartz components conform to SEMI C1 (chemical specifications), SEMI F20 (inertness of materials in ultra-pure chemical distribution), and SEMI F57 guidelines. Traceable Lot Inspection Certificates accompany every custom production order, documenting full GD-MS chemical assay results.
Global research institutes and corporate procurement teams can submit sketches, PDF drawings, or 3D STEP/IGES files. Our bilingual technical engineering team completes Design-for-Manufacturability (DFM) reviews within 24 hours, evaluating wall-thickness stresses, weld seam clearances, and thermal gradient optimization.
Components undergo multi-stage ultrasonic degreasing, HF surface oxide stripping, and 18.2 MΩ·cm DI water washing before entering our Class 1,000 cleanroom. Parts are vacuum sealed in anti-static PE bags with nitrogen purging, suspended inside shock-absorbing custom foam crates guaranteed for zero-breakage ocean and air freight.
Essential dimensional, thermal, and chemical parameters needed by Southeast Quartz technical estimators to confirm lead time, tooling, and quotation.
Furnish Outer Diameter (OD), Inner Diameter (ID), total length, wall thickness uniformity, run-out concentricity, and parallelism. Specify whether standard ISO 2768-m tolerance suffices (±0.2 mm) or if high-precision CNC grinding is mandatory (±0.02 mm).
Define normal continuous operating temperature (°C), maximum peak ramp temperature, thermal cycling frequency (hours per cycle), atmosphere (vacuum, argon, forming gas, oxidizer, or corrosive fluorides), and vacuum pressure thresholds (Torr or mbar).
Specify end-finishing: fine diamond cut, fire-polished, frosted (sandblasted), or optical mirror finish (Ra < 1 nm). Detail all ports: standard taper joints (ST), ball-and-socket joints, GL threads, NW/KF quick vacuum flanges, or flat ground flanges.
Solid fused silica rods, high-purity semiconductor wafer boats, analytical flow cells, and heavy-duty quartz components built to stringent laboratory drawings.
In-depth answers addressing thermal stress, devitrification kinetics, chemical exposure thresholds, and custom manufacturing criteria.
Submit your CAD drawings or dimensional requirements directly to our factory engineering staff. Our Donghai fabrication plant delivers certified factory-direct quotations, material lot assays, and lead-time commitments within 24 business hours.
