Modern front-end-of-line (FEOL) and back-end-of-line (BEOL) semiconductor manufacturing sequences require hundreds of cleaning steps. Fused quartz cleaning tanks serve as the critical frontier against atomic defectivity.
Standard borosilicate or low-grade plastics leach sodium, iron, and boron under acidic attack. Our high-purity natural and synthetic quartz tanks maintain total elemental impurities below 15 ppm, preventing gate oxide degradation and deep-level junction leakage.
Engineered to withstand prolonged exposure to hot SPM (Piranha: H₂SO₄/H₂O₂ at 130°C–180°C), SC-1 (NH₄OH/H₂O₂), SC-2 (HCl/H₂O₂), and diluted hydrofluoric acid (DHF) without surface spalling, micro-crazing, or volumetric stress erosion.
Seamlessly bonded quartz cleaning baths support acoustic wave transmission between 700 kHz and 3 MHz. Precision-ground bottom wall thicknesses ensure uniform cavitation distribution without inducing destructive resonant dampening or localized glass shear.
From single-wafer automated wet benches in Hsinchu to batch immersion cassettes in Dresden, customized quartz chip cleaning tanks maintain operational equilibrium.
Employed in automated RCA clean benches for 200mm and 300mm wafer cassettes. Essential for pre-diffusion stripping, post-CMP slurry removal, and photoresist strip basins operating at continuous ultra-high temperatures.
High-voltage power electronics demand high-temperature molten KOH etching and aggressive acid cleaning. Our thermal-shock-resistant quartz baths provide zero crystalline failure during thermal cyclings from 20°C to 280°C.
Provides dead-zone-free chemical flow regimes. The ultra-smooth inner flame-polished surface (Ra < 0.2 μm) prevents chemical stagnant zones, eliminating sub-micron particle redeposition on phase-shift masks (PSM).
Large-format quartz texturing baths support TOPCon and Heterojunction (HJT) N-type solar wafer production, resisting alkaline texturing cocktails (KOH/additives) with high mechanical strength and extended tank lifespans.
Operating out of Donghai, Jiangsu—the epicentre of global silica refining—Southeast Quartz bridges high-volume capacity with micron-level artisanal hot-working.
Proximity to first-tier high-purity natural quartz sand and plasma-fused ingot reserves guarantees consistent raw-feed purity, shielding international B2B clients from global raw-material bottlenecks and extended lead-time disruptions.
Unlike bonded sheets held by adhesive cements that quickly fail under SPM conditions, our tanks employ five-sided oxy-hydrogen monolithic flame fusion and vacuum stress annealing, resulting in continuous grain boundaries and zero residual stress.
Every single fabricated bath is subjected to helium mass-spectrometer vacuum leak tests, full-profile CMM dimensional validation, and laser interferometry to verify optical-grade wall uniformity across megasonic transducer faces.
As process geometries shrink below 2nm (GAAFET architecture), contamination tolerance approaches zero. Here is how our production facilities are adapting.
Transitioning from purified natural quartz to synthetic fused silica (SFS) for critical FEOL processes. Provides hydroxyl-controlled (low-OH), bubble-free structures with heavy metallic impurities undetectable even via ICP-MS.
Leveraging 5-axis CNC ultrasonic cold machining to produce radiused interior corners (R ≥ 5mm) and sloped bottom drainage profiles, reducing dead-zone recirculations by 78% and eliminating micro-bubble cavitation pitting.
Embedding transparent optical waveguiding interfaces and thermal-sensor thermowells directly into the fused quartz tank structure, enabling real-time inline monitoring of chemical degredation, flow rate, and process temperature without intrusive metallic probes.
We engineer equipment consumables according to strict international semiconductor equipment and materials protocols.
All quartzware tanks are engineered in compliance with SEMI F47, SEMI S2, and SEMI S8 guidelines, guaranteeing chemical compatibility, flammability safety, and precise ergonomic mounting integration into major OEM wet benches.
Prior to shipment, finished chip cleaning tanks undergo multi-stage ultrasonic deionized water cascade purging (resistivity > 18.2 MΩ·cm) within a Class 100 cleanroom, followed by vacuum-sealed double-bag packaging with nitrogen flushing.
Our CAD/CAM engineering office accepts STEP, IGES, and DWG drawings, providing fully certified DFM (Design for Manufacturability) reports within 24 hours and expedited prototype sample runs within 7–10 days.
Direct answers to the most common queries from fab maintenance engineers, cleanroom operators, and procurement specialists.
